Discrete to Module

Overview

iCuTech’s Discrete-to-Module (D2M) approach enables the integration of fully tested and qualified standard SMD components into advanced power electronic modules. By leveraging components from leading suppliers, D2M combines reliable sourcing with high design flexibility and efficient implementation. This concept allows the development of scalable and adaptable module solutions while maintaining high manufacturing yield and consistent quality. In combination with iCuTech’s laser welding technology, D2M supports robust interconnection and efficient production processes.

Concept & Architecture

D2M is based on the direct integration of discrete semiconductor components into a module architecture, replacing traditional approaches that rely on customized chip packaging. This enables:

• Use of qualified standard components
• Flexible module configuration
• Reduced dependency on custom semiconductor packaging
• Scalable and adaptable design concepts

Scalable Module Concepts
D2M supports modular and adaptable system architectures.

Integration with LWT

D2M is closely linked with iCuTech’s Laser Welding Technology (LWT), which enables precise and reliable interconnection of standard components without solder.

• Direct metallic connections via laser welding
• Reduced thermal stress compared to soldering
• High precision and repeatability
• Robust interconnection for demanding applications

Design Impact

D2M enables new approaches in power module design:

• Integration of standard SMD components into module-level architectures
• Simplified supply chain through use of standard parts
• Flexible adaptation to different voltage and current classes
• Efficient transition from development to production

Applications

D2M is used across a wide range of power electronic applications:

• Industrial power electronics
• Automotive and mobility systems
• Renewable energy systems
• Integrated motor solutions